Company Overview & Global Footprint

• Founded: October 2021 (Joint venture with National Innovation Fund, officially operating since 2023)
• Paid-in Capital: USD 15 million, Foxconn holding 99%
• Employees: Around 200 (as of December 2024, including 140 chip/system/engineering professionals)
• Locations:
  • Headquarters & R&D Center: Zhubei, Hsinchu
  • Module Factory: Hukou, Hsinchu (SiC / IGBT)
  • Sales & Tech Centers: Taipei, Shenzhen, Suzhou, San Jose

Vision & Strategic Positioning

PowerX Semiconductor aligns with Foxconn’s “3+3” transformation strategy, focusing on three future industries (EVs, digital health, robotics) and three core technologies (semiconductors, AI, 5G/6G).

As a key enabler of Foxconn’s EV semiconductor supply chain, PowerX plays a vital role from IC design and power device development to module manufacturing and system-level integration—bridging the entire value chain from chips to integrated modules.

We are committed to becoming a leading analog and power semiconductor solution provider, offering innovative and stable product platforms that enable customer product differentiation and enhance market competitiveness.

Product Integration Strategy & Technical Architecture

PowerX Semiconductor adopts a “Chip Platform + Module Integration” approach, delivering complete solutions for EVs, energy management, ICT, and lighting—covering from core power control to upper-layer module applications.

• Analog & Power ICs: Power management, protection, communication, and sensing ICs, designed in-house with high performance and low power architecture.
• Power Modules: Automotive-grade SiC/IGBT modules and industrial EZPIM series, supporting 650V–1200V platforms.
• Energy Control Modules: PowerFuse Pro and PowerSense Pro, integrating protection, measurement, and digital communication for EV/ESS/UPS systems.
• LED Optical Modules: Combining driver ICs, optical design, and fault protection for smart automotive lighting and signaling.

PowerX further expands its architecture capabilities by offering custom manufacture of semiconductor wafers, enabling proprietary process development tailored to customer-specific functionality and electrical performance needs. This includes customizing wafer properties such as size, doping profile, and surface characteristics, providing precision-aligned silicon substrates for differentiated IC designs across power electronics and advanced microelectronics applications.
Through modular and platform-based product design, we simplify customer systems, enhance development efficiency, and fully support the evolution of power and digital applications.

High-Standard Manufacturing & Flexible Capacity

PowerX Semiconductor has established a complete power module manufacturing chain, encompassing packaging design, material processing, assembly integration, electrical testing, and reliability validation. Our in-house module factory has implemented a quality management system aligned with IATF 16949 standards and has passed third-party audits. We are on track to obtain the IATF 16949 Letter of Compliance (LOC) by 2025, steadily progressing toward full automotive-grade manufacturing compliance.

Our production integrates digital systems and standardized process platforms, enabling quick transitions across Si / SiC / IGBT module processes and supporting flexible delivery of HPD, TPAK, XCP, and EZPIM module types.
In addition to module packaging and assembly, PowerX incorporates epoxy resin processing—including precision dispensing, curing, and molding—tailored to the mechanical and thermal demands of each module type. This enhances insulation reliability, heat dissipation, and environmental durability, especially in automotive and energy applications requiring high resilience.

With ongoing expansion of production lines and advanced equipment, we ensure high-volume, flexible, and consistent delivery of premium-quality modules for automotive, energy storage, and industrial control applications—with support for customization.

Strategic Alliances & Co-Development

PowerX Semiconductor is certified to ISO 26262 automotive functional safety (ASIL-D), with full process and development capability to support safety targets in automotive systems.

We collaborate closely with global Tier-1 integrators and OEMs to co-develop functional safety-compliant workflows, diagnostic mechanisms, and system-level innovations in automotive power and protection modules.

Our alliances span advanced EV platforms, smart power management, and distributed modular architectures—accelerating go-to-market through co-development and helping customers achieve differentiated, safety-verified system solutions.