Company Overview
PowerX Semiconductor, headquartered in Hsinchu, Taiwan, specializes in IC design and development. Our product portfolio includes analog ICs, power semiconductor modules, and integrated IC solutions. We offer a complete and reliable product lineup to global automotive and ICT markets, as well as to strategic system manufacturing partners, aiming to become a trusted semiconductor partner.
Company Profile & Global Presence
- Founded: October 2021 (Co-invested with GCIC, full operations since 2023)
- Capital: USD 15M (99% owned by Foxconn)
- Employees: Approx. 200 (as of Dec 2024; including 140 chip/system/engineering professionals)
- Global footprint:
- Headquarters & R&D Center: Zhubei, Hsinchu
- Module Factory: Hukou, Hsinchu (SiC / IGBT)
- Business & Technical Support: Taipei, Shenzhen, Suzhou, San Jose

Foxconn 3+3 Strategic Alignment
PowerX Semiconductor is part of Foxconn's 3+3 transformation strategy, which focuses on three future industries (EVs, Digital Health, Robotics) and three core technologies (Semiconductors, AI, 5G/6G).
PowerX is positioned as the key platform for the EV semiconductor vertical, responsible for IC design, power devices, module manufacturing, and solution integration.
- Key products:
- Power / analog IC design
- Si / SiC MOSFET development
- SiC / IGBT module design & manufacturing
- Automotive / industrial control module solutions

Vision & Mission
To become the leading provider of power and analog semiconductor solutions, combining product competitiveness and reliable supply to be the partner of choice.
Driven by in-house R&D, architecture optimization, and system-level integration, we deliver highly competitive automotive and ICT solutions that maximize system performance and cost efficiency.

Vertical Integration for System Advantage
PowerX Semiconductor integrates the full value chain—from R&D to architecture, manufacturing, and delivery. Through vertical integration, we provide high-efficiency, stable solutions to automotive, ICT, and strategic partners, empowering differentiation and global competitiveness.

Advanced Power Module Manufacturing
- Molded / frame-type module design
- Die attach and sintering process
- Substrate attach & wire bonding
- Epoxy dispensing, curing, and process control
- Encapsulation & mechanical integration
- Final electrical testing & reliability validation
Through our dedicated factory and automation processes, we deliver high-performance, high-reliability power modules that meet automotive and industrial-grade requirements.

Scalable Production Capacity
With ongoing investments in new production lines and automation, PowerX has flexible capacity to support customer growth while maintaining consistent product quality and reliable delivery.

Strategic Partnership & Co-Development
We collaborate with global Tier-1 integrators and automotive OEMs to jointly develop power module solutions for EVs and intelligent systems—accelerating product innovation and creating competitive advantages.